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Home > England & Wales Companies > IDB TECHNOLOGIES LIMITED
Company Information for

IDB TECHNOLOGIES LIMITED

C/O BEGBIES TRAYNOR, 3RD FLOOR CASTLEMEAD, LOWER CASTLE STREET, BRISTOL, BS1 3AG,
Company Registration Number
03469298
Private Limited Company
Liquidation

Company Overview

About Idb Technologies Ltd
IDB TECHNOLOGIES LIMITED was founded on 1997-11-21 and has its registered office in Bristol. The organisation's status is listed as "Liquidation". Idb Technologies Limited is a Private Limited Company registered in with Companies House and the accounts submission requirement is categorised as TOTAL EXEMPTION FULL
  • Company qualifies as a small company
  • Company has filed full accounts
  • Company is exempt from audit
  • Annual turnover is less than £6.5 million
  • The balance sheet total is less than £ 3.26 million
  • Employs less than 50 employees
Key Data
Company Name
IDB TECHNOLOGIES LIMITED
 
Legal Registered Office
C/O BEGBIES TRAYNOR, 3RD FLOOR CASTLEMEAD
LOWER CASTLE STREET
BRISTOL
BS1 3AG
Other companies in SN12
 
Filing Information
Company Number 03469298
Company ID Number 03469298
Date formed 1997-11-21
Country 
Origin Country United Kingdom
Type Private Limited Company
CompanyStatus Liquidation
Lastest accounts 30/04/2017
Account next due 31/01/2019
Latest return 21/11/2015
Return next due 19/12/2016
Type of accounts TOTAL EXEMPTION FULL
VAT Number /Sales tax ID GB709774792  
Last Datalog update: 2023-06-05 15:12:57
Primary Source:Companies House
There are multiple companies registered at this address, the registered address may be the accountant's offices for IDB TECHNOLOGIES LIMITED
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Companies with same name IDB TECHNOLOGIES LIMITED
The following companies were found which have the same name as IDB TECHNOLOGIES LIMITED. These may be the same company in different jurisdictions
  Registered addressLast known statusFormation date
IDB TECHNOLOGIES PTE. LTD. MAXWELL ROAD Singapore 069113 Active Company formed on the 2019-04-02
IDB TECHNOLOGIES LIMITED Unknown

Company Officers of IDB TECHNOLOGIES LIMITED

Current Directors
Officer Role Date Appointed
IAN DAVID BURNETT
Company Secretary 2007-12-01
IAN DAVID BURNETT
Director 1997-11-21
TANYA JAYNE COLES
Director 2007-12-01
Previous Officers
Officer Role Date Appointed Date Resigned
BEVERLY ANN BURNETT
Company Secretary 1997-11-21 2007-12-01
BEVERLY ANN BURNETT
Director 1997-11-21 2007-12-01
CFL SECRETARIES LIMITED
Nominated Secretary 1997-11-21 1997-11-21
CFL DIRECTORS LIMITED
Nominated Director 1997-11-21 1997-11-21

Related Directorships

Officer Related Company Role Date Appointed Role StatusIncorporation dateCompany Status
IAN DAVID BURNETT FLEXIBLE BARRIER FILMS LTD. Director 2012-01-12 CURRENT 2012-01-12 Active
IAN DAVID BURNETT JEMI UK LIMITED Director 1996-07-02 CURRENT 1992-07-16 Active

More director information

Corporation Filing History
Companies House Filing History
This is a record of the public documents (corporate filing) lodged from Companies House where the company has filed annual returns and other statutory filing documents. Examples of documents filed include: change of registered office, accounts filing, director/officer appointments & resignations, changes in share capital, shareholder members lists etc.

DateDocument TypeDocument Description
2023-04-08Voluntary liquidation Statement of receipts and payments to 2023-01-29
2023-04-05REGISTERED OFFICE CHANGED ON 05/04/23 FROM St James Court St James Parade Bristol BS1 3LH
2022-03-31LIQ03Voluntary liquidation Statement of receipts and payments to 2022-01-29
2021-04-07LIQ03Voluntary liquidation Statement of receipts and payments to 2021-01-29
2020-05-26LIQ03Voluntary liquidation Statement of receipts and payments to 2020-01-29
2019-02-22AD01REGISTERED OFFICE CHANGED ON 22/02/19 FROM 91 Corsham Road Whitley Melksham Wiltshire SN12 8QF
2019-02-21LIQ01Voluntary liquidation declaration of solvency
2019-02-21600Appointment of a voluntary liquidator
2019-02-21LRESSPResolutions passed:
  • Special resolution to wind up on 2019-01-30
2018-11-14CS01CONFIRMATION STATEMENT MADE ON 14/11/18, WITH NO UPDATES
2018-01-30AA30/04/17 ACCOUNTS TOTAL EXEMPTION FULL
2017-11-26LATEST SOC26/11/17 STATEMENT OF CAPITAL;GBP 50001
2017-11-26CS01CONFIRMATION STATEMENT MADE ON 14/11/17, WITH UPDATES
2017-07-28PSC04Change of details for Mr Ian David Burnett as a person with significant control on 2017-03-01
2016-12-05LATEST SOC05/12/16 STATEMENT OF CAPITAL;GBP 50011
2016-12-05CS01CONFIRMATION STATEMENT MADE ON 14/11/16, WITH UPDATES
2016-11-01AA30/04/16 ACCOUNTS TOTAL EXEMPTION SMALL
2015-12-02SH0121/11/15 STATEMENT OF CAPITAL GBP 50011
2015-12-02LATEST SOC02/12/15 STATEMENT OF CAPITAL;GBP 50011
2015-12-02AR0121/11/15 ANNUAL RETURN FULL LIST
2015-10-19AA30/04/15 ACCOUNTS TOTAL EXEMPTION SMALL
2015-01-29AA30/04/14 ACCOUNTS TOTAL EXEMPTION SMALL
2014-12-03LATEST SOC03/12/14 STATEMENT OF CAPITAL;GBP 50001
2014-12-03AR0121/11/14 ANNUAL RETURN FULL LIST
2014-01-31AA30/04/13 ACCOUNTS TOTAL EXEMPTION SMALL
2013-11-21LATEST SOC21/11/13 STATEMENT OF CAPITAL;GBP 50001
2013-11-21AR0121/11/13 ANNUAL RETURN FULL LIST
2013-01-30AA30/04/12 ACCOUNTS TOTAL EXEMPTION SMALL
2012-12-12AR0121/11/12 ANNUAL RETURN FULL LIST
2012-01-28AA30/04/11 ACCOUNTS TOTAL EXEMPTION SMALL
2011-12-02AR0121/11/11 ANNUAL RETURN FULL LIST
2011-01-30AA30/04/10 ACCOUNTS TOTAL EXEMPTION SMALL
2010-12-02AR0121/11/10 ANNUAL RETURN FULL LIST
2010-02-16AA30/04/09 ACCOUNTS TOTAL EXEMPTION SMALL
2009-12-03AR0121/11/09 ANNUAL RETURN FULL LIST
2009-12-03CH01DIRECTOR'S CHANGE OF PARTICULARS / DIRECTOR TANYA JAYNE COLES / 02/12/2009
2009-12-02CH01DIRECTOR'S CHANGE OF PARTICULARS / IAN DAVID BURNETT / 02/12/2009
2009-03-03AA30/04/08 TOTAL EXEMPTION SMALL
2008-12-16363aRETURN MADE UP TO 21/11/08; FULL LIST OF MEMBERS
2008-12-12190LOCATION OF DEBENTURE REGISTER
2008-12-12353LOCATION OF REGISTER OF MEMBERS
2008-12-12288cDIRECTOR AND SECRETARY'S CHANGE OF PARTICULARS / IAN BURNETT / 30/04/2008
2008-12-12288cDIRECTOR'S CHANGE OF PARTICULARS / TANYA COLES / 30/04/2008
2008-12-12287REGISTERED OFFICE CHANGED ON 12/12/2008 FROM 91 CORSHAM ROAD WHITELY MELKSHAM WILTSHIRE SN12 8QF
2008-12-11287REGISTERED OFFICE CHANGED ON 11/12/2008 FROM 2 ASHLEY CLOSE WINSCOMBE NORTH SOMERSET BS25 1DB
2008-01-29AATOTAL EXEMPTION FULL ACCOUNTS MADE UP TO 30/04/07
2007-12-13363aRETURN MADE UP TO 21/11/07; FULL LIST OF MEMBERS
2007-12-13288aNEW DIRECTOR APPOINTED
2007-12-13190LOCATION OF DEBENTURE REGISTER
2007-12-13353LOCATION OF REGISTER OF MEMBERS
2007-12-13287REGISTERED OFFICE CHANGED ON 13/12/07 FROM: 29 CHURCH ROAD WINSCOMBE NORTH SOMERSET BS25 1BJ
2007-12-13288aNEW SECRETARY APPOINTED
2007-12-13288cDIRECTOR'S PARTICULARS CHANGED
2007-12-13288bSECRETARY RESIGNED
2007-12-13288bDIRECTOR RESIGNED
2007-03-07AATOTAL EXEMPTION FULL ACCOUNTS MADE UP TO 30/04/06
2007-01-02363aRETURN MADE UP TO 21/11/06; FULL LIST OF MEMBERS
2006-01-31AATOTAL EXEMPTION FULL ACCOUNTS MADE UP TO 30/04/05
2005-11-30363aRETURN MADE UP TO 21/11/05; FULL LIST OF MEMBERS
2005-02-24AATOTAL EXEMPTION FULL ACCOUNTS MADE UP TO 30/04/04
2005-01-10363sRETURN MADE UP TO 21/11/04; FULL LIST OF MEMBERS
2004-02-26AATOTAL EXEMPTION FULL ACCOUNTS MADE UP TO 30/04/03
2003-12-17363sRETURN MADE UP TO 21/11/03; FULL LIST OF MEMBERS
2003-03-05AATOTAL EXEMPTION FULL ACCOUNTS MADE UP TO 30/04/02
2002-12-11363sRETURN MADE UP TO 21/11/02; FULL LIST OF MEMBERS
2002-01-29AATOTAL EXEMPTION FULL ACCOUNTS MADE UP TO 30/04/01
2001-11-29363sRETURN MADE UP TO 21/11/01; FULL LIST OF MEMBERS
2001-02-27(W)ELRESS366A DISP HOLDING AGM 20/02/01
2001-02-27AAFULL ACCOUNTS MADE UP TO 30/04/00
2001-02-27(W)ELRESS252 DISP LAYING ACC 20/02/01
2001-02-27(W)ELRESS386 DIS APP AUDS 20/02/01
2000-11-24363sRETURN MADE UP TO 21/11/00; FULL LIST OF MEMBERS
1999-12-13AAFULL ACCOUNTS MADE UP TO 30/04/99
1999-11-30363sRETURN MADE UP TO 21/11/99; FULL LIST OF MEMBERS
1999-06-21225ACC. REF. DATE EXTENDED FROM 30/11/98 TO 30/04/99
1998-12-11363sRETURN MADE UP TO 21/11/98; FULL LIST OF MEMBERS
1998-05-0688(2)RAD 29/03/98--------- £ SI 50000@1=50000 £ IC 1/50001
1998-04-09ERES04NC INC ALREADY ADJUSTED 28/03/98
1998-04-09123£ NC 1000/100000 28/03/98
1997-11-27288bSECRETARY RESIGNED
1997-11-27287REGISTERED OFFICE CHANGED ON 27/11/97 FROM: 82 WHITCHURCH ROAD CARDIFF CF4 3LX
1997-11-27288aNEW DIRECTOR APPOINTED
1997-11-27288aNEW SECRETARY APPOINTED;NEW DIRECTOR APPOINTED
1997-11-27288bDIRECTOR RESIGNED
1997-11-21NEWINCINCORPORATION DOCUMENTS CERTIFICATE OF INCORPORATION STATEMENT OF DIRECTORS & REGISTERED OFFICE DECLARATION OF COMPLIANCE MEMORANDUM OF ASSOCIATION ARTICLES OF ASSOCIATION
Industry Information
SIC/NAIC Codes
46 - Wholesale trade, except of motor vehicles and motorcycles
461 - Wholesale on a fee or contract basis
46140 - Agents involved in the sale of machinery, industrial equipment, ships and aircraft




Licences & Regulatory approval
We could not find any licences issued to IDB TECHNOLOGIES LIMITED or authorisation from an industry specific regulator to operate. These may not be required.
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Risks
Legal Notices
Appointment of Liquidators2019-02-08
Notices to Creditors2019-02-08
Fines / Sanctions
No fines or sanctions have been issued against IDB TECHNOLOGIES LIMITED
Liabilities
Mortgages / Charges
Total # Mortgages/Charges 0
Mortgages/Charges outstanding 0
Mortgages Partially Satisifed 0
Mortgages Satisfied/Paid 0
Details of Mortgagee Charges
IDB TECHNOLOGIES LIMITED does not have any mortgage charges so there is no mortgagee data available

  Average Max
MortgagesNumMortCharges1.309
MortgagesNumMortOutstanding0.809
MortgagesNumMortPartSatisfied0.005
MortgagesNumMortSatisfied0.509

This shows the max and average number of mortgages for companies with the same SIC code of 46140 - Agents involved in the sale of machinery, industrial equipment, ships and aircraft

Creditors
Creditors Due Within One Year 2012-05-01 £ 63,507

Creditors and other liabilities

Filed Financial Reports
Annual Accounts
2013-04-30
Annual Accounts
2014-04-30
Annual Accounts
2017-04-30

These are the financial reports (either an abhreviated set of accounts or profit& loss statement and balance sheet) have been filed with Companies House. The reports allow you to do a basic business credit check on IDB TECHNOLOGIES LIMITED

Financial Assets
Balance Sheet
Called Up Share Capital 2012-05-01 £ 50,001
Called Up Share Capital 2012-04-30 £ 50,001
Called Up Share Capital 2011-04-30 £ 50,001
Cash Bank In Hand 2012-05-01 £ 26,666
Cash Bank In Hand 2012-04-30 £ 52,313
Cash Bank In Hand 2011-04-30 £ 15,792
Current Assets 2012-05-01 £ 99,685
Current Assets 2012-04-30 £ 129,354
Current Assets 2011-04-30 £ 117,800
Debtors 2012-05-01 £ 39,169
Debtors 2012-04-30 £ 46,790
Debtors 2011-04-30 £ 76,474
Fixed Assets 2012-05-01 £ 18,771
Fixed Assets 2012-04-30 £ 25,017
Fixed Assets 2011-04-30 £ 33,238
Shareholder Funds 2012-05-01 £ 54,949
Shareholder Funds 2012-04-30 £ 66,826
Shareholder Funds 2011-04-30 £ 86,631
Stocks Inventory 2012-05-01 £ 33,850
Stocks Inventory 2012-04-30 £ 30,251
Stocks Inventory 2011-04-30 £ 25,534
Tangible Fixed Assets 2012-05-01 £ 18,771
Tangible Fixed Assets 2012-04-30 £ 25,017
Tangible Fixed Assets 2011-04-30 £ 33,238

Debtors and other cash assets

Intangible Assets
Patents
We have not found any records of IDB TECHNOLOGIES LIMITED registering or being granted any patents
Domain Names
We do not have the domain name information for IDB TECHNOLOGIES LIMITED
Trademarks
We have not found any records of IDB TECHNOLOGIES LIMITED registering or being granted any trademarks
Income
Government Income
We have not found government income sources for IDB TECHNOLOGIES LIMITED. This could be because the transaction value was below £ 500 with local government or below £ 25,000 for central government. We have found 8,000 supplier to government that are UK companies so approx 0.2% of companies listed on Datalog supply to government.

The top companies supplying to UK government with the same SIC code (46140 - Agents involved in the sale of machinery, industrial equipment, ships and aircraft) as IDB TECHNOLOGIES LIMITED are:

Outgoings
Business Rates/Property Tax
No properties were found where IDB TECHNOLOGIES LIMITED is liable for the business rates / property tax. This could be for a number of reasons.
  • The council hasnt published the data
  • We havent found or been able to process the councils data
  • The company is part of a group of companies and another company in the group is liable for business rates
  • The registered office may be a residential address which does not have a commercial designation. If the business is run from home then it won't be a commercial property and hence won't be liable for business rates.
  • Serviced offices are increasingly popular and therefore a business may not be paying business rates directly - the building owner is and this is incorporated in the office rental charge.
Import/Export of Goods
Goods imported/exported by IDB TECHNOLOGIES LIMITED
OriginDestinationDateImport CodeImported Goods classification description
2018-01-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2018-01-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-11-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-10-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-09-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-08-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-07-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-06-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-03-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-02-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-02-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2015-12-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-11-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-10-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-10-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2015-09-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-09-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2015-07-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-07-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-06-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2015-06-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2015-05-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-05-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-04-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-04-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2015-04-0185415000Semiconductor devices, n.e.s.
2015-04-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-04-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2015-04-0085415000Semiconductor devices, n.e.s.
2015-03-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-03-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2015-03-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-03-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2015-02-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2015-02-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2014-12-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2014-11-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2014-09-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2014-08-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2014-08-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2014-06-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2014-06-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2014-04-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2014-04-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2014-03-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-12-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-12-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-11-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-10-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-09-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-07-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-06-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-03-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-02-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-01-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-12-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-10-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-08-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-07-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-06-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-05-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-04-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-03-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-02-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-11-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-10-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-09-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-08-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-07-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-06-0129420000Separate chemically defined organic compounds, n.e.s.
2011-05-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-03-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-02-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-12-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-11-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-11-0185423190Electronic integrated circuits as processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits (excl. in the form of multichip integrated circuits)
2010-10-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-09-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-09-0185423190Electronic integrated circuits as processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits (excl. in the form of multichip integrated circuits)
2010-08-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-08-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-07-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-06-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-04-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-03-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-03-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-02-0138109090Fluxes and other auxiliary preparations for soldering, brazing or welding (excl. preparations of a kind used as cores or coatings for welding electrodes or rods, soldering, brazing or welding powders and pastes consisting of metal and other materials, and welding electrodes or rods of base metals or metal carbides coated with fluxes)
2010-02-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-01-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)

For goods imported into the United Kingdom, only imports originating from outside the EU are shown

Legal Notices/Action
Initiating party Event TypeNotices to Creditors
Defending partyIDB TECHNOLOGIES LIMITEDEvent Date2019-02-05
(Registered in England and Wales) ("the Company") The Company was placed into members' voluntary liquidation on 30 January 2019 when Simon Robert Haskew (IP Number 008988 ) and Neil Frank Vinnicombe (IP Number 009519 ), both of Begbies Traynor (Central) LLP , of St James Court, St James Parade, Bristol BS1 3LH were appointed as Joint Liquidators of the Company. The Company is able to pay all its known creditors in full. Notice is hereby given, pursuant to Part 14 of the Insolvency (England and Wales) Rules 2016, that the Joint Liquidators of the Company intend to make a distribution to creditors. Creditors of the Company are required, on or before 8 March 2019, to prove their debts by sending to Simon Robert Haskew of Begbies Traynor (Central) LLP, of St James Court, St James Parade, Bristol BS1 3LH, the Joint Liquidator of the Company, written statements of the amount they claim to be due to them from the Company. They must also, if so requested, provide such further details or produce such documentary or other evidence as may appear to the Joint Liquidators to be necessary. A creditor who has not proved his debt before 8 March 2019, or who increases the claim in his proof after that date, will not be entitled to disturb, by reason that he has not participated in it, the intended distribution or any other distribution declared before his debt is proved. The Joint Liquidators intend that, after paying or providing for a first and final distribution in respect of the claims of all creditors who have proved their debts by the above date, the funds remaining in the hands of the Joint Liquidators shall be distributed to shareholders absolutely. Contact Details Proofs of debts must be delivered to the Joint Liquidators and can be sent by post to Begbies Traynor (Central) LLP, of St James Court, St James Parade, Bristol BS1 3LH or alternatively by email to caroline.priest@begbies-traynor.com . Any person who requires further information may contact the Joint Liquidator by telephone on 0117 937 7130 . Alternatively enquiries can be made to Caroline Priest by telephone on 0117 937 7130. Simon Haskew , Joint Liquidator :
 
Initiating party Event TypeAppointment of Liquidators
Defending partyIDB TECHNOLOGIES LIMITEDEvent Date2019-01-30
Simon Robert Haskew and Neil Frank Vinnicombe , both of Begbies Traynor (Central) LLP , St James Court, St James Parade, Bristol BS1 3LH :
 
Initiating party Event TypeResolutions for Winding-up
Defending partyIDB TECHNOLOGIES LIMITEDEvent Date2019-01-30
Notification of written resolutions of the above-named Company proposed by the directors and having effect as a special resolution and as an ordinary resolution respectively pursuant to the provisions of Part 13 of the Companies Act 2006 . Circulation Date: 29 January 2019 Effective Date: 30 January 2019 I, the undersigned, being a director of the Company hereby certify that the following written resolutions were circulated to all eligible members of the Company on the Circulation Date and that the written resolutions were passed on the Effective Date: "That the Company be wound up voluntarily and that Simon Robert Haskew and Neil Frank Vinnicombe both of Begbies Traynor (Central) LLP of St James Court, St James Parade, Bristol, BS1 3LH be and are hereby appointed as joint liquidators for the purposes of such winding up and that any power conferred on them by law or by this resolution, may be exercised and any act required or authorised under any enactment to be done by them, may be done by them jointly or by each of them alone." Simon Robert Haskew (IP Number: 008988 ) and Neil Frank Vinnicombe (IP Number: 009519 ). Any person who requires further information may contact the Joint Liquidator by telephone on 0117 937 7130 . Alternatively enquiries can be made to Caroline Priest by e-mail at caroline.priest@begbies-traynor.com or by telephone on 0117 937 7130. Ian David Burnett :
 
Government Grants / Awards
Technology Strategy Board Awards
The Technology Strategy Board has not awarded IDB TECHNOLOGIES LIMITED any grants or awards. Grants from the TSB are an indicator that the company is investing in new technologies or IPR
European Union CORDIS Awards
The European Union has not awarded IDB TECHNOLOGIES LIMITED any grants or awards.
Ownership
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