Company Information for IDB TECHNOLOGIES LIMITED
C/O BEGBIES TRAYNOR, 3RD FLOOR CASTLEMEAD, LOWER CASTLE STREET, BRISTOL, BS1 3AG,
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Company Registration Number
03469298
Private Limited Company
Liquidation |
Company Name | |
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IDB TECHNOLOGIES LIMITED | |
Legal Registered Office | |
C/O BEGBIES TRAYNOR, 3RD FLOOR CASTLEMEAD LOWER CASTLE STREET BRISTOL BS1 3AG Other companies in SN12 | |
Company Number | 03469298 | |
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Company ID Number | 03469298 | |
Date formed | 1997-11-21 | |
Country | ||
Origin Country | United Kingdom | |
Type | Private Limited Company | |
CompanyStatus | Liquidation | |
Lastest accounts | 30/04/2017 | |
Account next due | 31/01/2019 | |
Latest return | 21/11/2015 | |
Return next due | 19/12/2016 | |
Type of accounts | TOTAL EXEMPTION FULL | |
VAT Number /Sales tax ID |
Last Datalog update: | 2023-06-05 15:12:57 |
Companies House |
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Registered address | Last known status | Formation date | ||
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IDB TECHNOLOGIES PTE. LTD. | MAXWELL ROAD Singapore 069113 | Active | Company formed on the 2019-04-02 | |
IDB TECHNOLOGIES LIMITED | Unknown |
Officer | Role | Date Appointed |
---|---|---|
IAN DAVID BURNETT |
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IAN DAVID BURNETT |
||
TANYA JAYNE COLES |
Officer | Role | Date Appointed | Date Resigned |
---|---|---|---|
BEVERLY ANN BURNETT |
Company Secretary | ||
BEVERLY ANN BURNETT |
Director | ||
CFL SECRETARIES LIMITED |
Nominated Secretary | ||
CFL DIRECTORS LIMITED |
Nominated Director |
Officer | Related Company | Role | Date Appointed | Role Status | Incorporation date | Company Status |
---|---|---|---|---|---|---|
FLEXIBLE BARRIER FILMS LTD. | Director | 2012-01-12 | CURRENT | 2012-01-12 | Active | |
JEMI UK LIMITED | Director | 1996-07-02 | CURRENT | 1992-07-16 | Active |
Date | Document Type | Document Description |
---|---|---|
Voluntary liquidation Statement of receipts and payments to 2023-01-29 | ||
REGISTERED OFFICE CHANGED ON 05/04/23 FROM St James Court St James Parade Bristol BS1 3LH | ||
LIQ03 | Voluntary liquidation Statement of receipts and payments to 2022-01-29 | |
LIQ03 | Voluntary liquidation Statement of receipts and payments to 2021-01-29 | |
LIQ03 | Voluntary liquidation Statement of receipts and payments to 2020-01-29 | |
AD01 | REGISTERED OFFICE CHANGED ON 22/02/19 FROM 91 Corsham Road Whitley Melksham Wiltshire SN12 8QF | |
LIQ01 | Voluntary liquidation declaration of solvency | |
600 | Appointment of a voluntary liquidator | |
LRESSP | Resolutions passed:
| |
CS01 | CONFIRMATION STATEMENT MADE ON 14/11/18, WITH NO UPDATES | |
AA | 30/04/17 ACCOUNTS TOTAL EXEMPTION FULL | |
LATEST SOC | 26/11/17 STATEMENT OF CAPITAL;GBP 50001 | |
CS01 | CONFIRMATION STATEMENT MADE ON 14/11/17, WITH UPDATES | |
PSC04 | Change of details for Mr Ian David Burnett as a person with significant control on 2017-03-01 | |
LATEST SOC | 05/12/16 STATEMENT OF CAPITAL;GBP 50011 | |
CS01 | CONFIRMATION STATEMENT MADE ON 14/11/16, WITH UPDATES | |
AA | 30/04/16 ACCOUNTS TOTAL EXEMPTION SMALL | |
SH01 | 21/11/15 STATEMENT OF CAPITAL GBP 50011 | |
LATEST SOC | 02/12/15 STATEMENT OF CAPITAL;GBP 50011 | |
AR01 | 21/11/15 ANNUAL RETURN FULL LIST | |
AA | 30/04/15 ACCOUNTS TOTAL EXEMPTION SMALL | |
AA | 30/04/14 ACCOUNTS TOTAL EXEMPTION SMALL | |
LATEST SOC | 03/12/14 STATEMENT OF CAPITAL;GBP 50001 | |
AR01 | 21/11/14 ANNUAL RETURN FULL LIST | |
AA | 30/04/13 ACCOUNTS TOTAL EXEMPTION SMALL | |
LATEST SOC | 21/11/13 STATEMENT OF CAPITAL;GBP 50001 | |
AR01 | 21/11/13 ANNUAL RETURN FULL LIST | |
AA | 30/04/12 ACCOUNTS TOTAL EXEMPTION SMALL | |
AR01 | 21/11/12 ANNUAL RETURN FULL LIST | |
AA | 30/04/11 ACCOUNTS TOTAL EXEMPTION SMALL | |
AR01 | 21/11/11 ANNUAL RETURN FULL LIST | |
AA | 30/04/10 ACCOUNTS TOTAL EXEMPTION SMALL | |
AR01 | 21/11/10 ANNUAL RETURN FULL LIST | |
AA | 30/04/09 ACCOUNTS TOTAL EXEMPTION SMALL | |
AR01 | 21/11/09 ANNUAL RETURN FULL LIST | |
CH01 | DIRECTOR'S CHANGE OF PARTICULARS / DIRECTOR TANYA JAYNE COLES / 02/12/2009 | |
CH01 | DIRECTOR'S CHANGE OF PARTICULARS / IAN DAVID BURNETT / 02/12/2009 | |
AA | 30/04/08 TOTAL EXEMPTION SMALL | |
363a | RETURN MADE UP TO 21/11/08; FULL LIST OF MEMBERS | |
190 | LOCATION OF DEBENTURE REGISTER | |
353 | LOCATION OF REGISTER OF MEMBERS | |
288c | DIRECTOR AND SECRETARY'S CHANGE OF PARTICULARS / IAN BURNETT / 30/04/2008 | |
288c | DIRECTOR'S CHANGE OF PARTICULARS / TANYA COLES / 30/04/2008 | |
287 | REGISTERED OFFICE CHANGED ON 12/12/2008 FROM 91 CORSHAM ROAD WHITELY MELKSHAM WILTSHIRE SN12 8QF | |
287 | REGISTERED OFFICE CHANGED ON 11/12/2008 FROM 2 ASHLEY CLOSE WINSCOMBE NORTH SOMERSET BS25 1DB | |
AA | TOTAL EXEMPTION FULL ACCOUNTS MADE UP TO 30/04/07 | |
363a | RETURN MADE UP TO 21/11/07; FULL LIST OF MEMBERS | |
288a | NEW DIRECTOR APPOINTED | |
190 | LOCATION OF DEBENTURE REGISTER | |
353 | LOCATION OF REGISTER OF MEMBERS | |
287 | REGISTERED OFFICE CHANGED ON 13/12/07 FROM: 29 CHURCH ROAD WINSCOMBE NORTH SOMERSET BS25 1BJ | |
288a | NEW SECRETARY APPOINTED | |
288c | DIRECTOR'S PARTICULARS CHANGED | |
288b | SECRETARY RESIGNED | |
288b | DIRECTOR RESIGNED | |
AA | TOTAL EXEMPTION FULL ACCOUNTS MADE UP TO 30/04/06 | |
363a | RETURN MADE UP TO 21/11/06; FULL LIST OF MEMBERS | |
AA | TOTAL EXEMPTION FULL ACCOUNTS MADE UP TO 30/04/05 | |
363a | RETURN MADE UP TO 21/11/05; FULL LIST OF MEMBERS | |
AA | TOTAL EXEMPTION FULL ACCOUNTS MADE UP TO 30/04/04 | |
363s | RETURN MADE UP TO 21/11/04; FULL LIST OF MEMBERS | |
AA | TOTAL EXEMPTION FULL ACCOUNTS MADE UP TO 30/04/03 | |
363s | RETURN MADE UP TO 21/11/03; FULL LIST OF MEMBERS | |
AA | TOTAL EXEMPTION FULL ACCOUNTS MADE UP TO 30/04/02 | |
363s | RETURN MADE UP TO 21/11/02; FULL LIST OF MEMBERS | |
AA | TOTAL EXEMPTION FULL ACCOUNTS MADE UP TO 30/04/01 | |
363s | RETURN MADE UP TO 21/11/01; FULL LIST OF MEMBERS | |
(W)ELRES | S366A DISP HOLDING AGM 20/02/01 | |
AA | FULL ACCOUNTS MADE UP TO 30/04/00 | |
(W)ELRES | S252 DISP LAYING ACC 20/02/01 | |
(W)ELRES | S386 DIS APP AUDS 20/02/01 | |
363s | RETURN MADE UP TO 21/11/00; FULL LIST OF MEMBERS | |
AA | FULL ACCOUNTS MADE UP TO 30/04/99 | |
363s | RETURN MADE UP TO 21/11/99; FULL LIST OF MEMBERS | |
225 | ACC. REF. DATE EXTENDED FROM 30/11/98 TO 30/04/99 | |
363s | RETURN MADE UP TO 21/11/98; FULL LIST OF MEMBERS | |
88(2)R | AD 29/03/98--------- £ SI 50000@1=50000 £ IC 1/50001 | |
ERES04 | NC INC ALREADY ADJUSTED 28/03/98 | |
123 | £ NC 1000/100000 28/03/98 | |
288b | SECRETARY RESIGNED | |
287 | REGISTERED OFFICE CHANGED ON 27/11/97 FROM: 82 WHITCHURCH ROAD CARDIFF CF4 3LX | |
288a | NEW DIRECTOR APPOINTED | |
288a | NEW SECRETARY APPOINTED;NEW DIRECTOR APPOINTED | |
288b | DIRECTOR RESIGNED | |
NEWINC | INCORPORATION DOCUMENTS CERTIFICATE OF INCORPORATION STATEMENT OF DIRECTORS & REGISTERED OFFICE DECLARATION OF COMPLIANCE MEMORANDUM OF ASSOCIATION ARTICLES OF ASSOCIATION |
Appointment of Liquidators | 2019-02-08 |
Notices to Creditors | 2019-02-08 |
Total # Mortgages/Charges | 0 |
---|---|
Mortgages/Charges outstanding | 0 |
Mortgages Partially Satisifed | 0 |
Mortgages Satisfied/Paid | 0 |
Average | Max | |
MortgagesNumMortCharges | 1.30 | 9 |
MortgagesNumMortOutstanding | 0.80 | 9 |
MortgagesNumMortPartSatisfied | 0.00 | 5 |
MortgagesNumMortSatisfied | 0.50 | 9 |
This shows the max and average number of mortgages for companies with the same SIC code of 46140 - Agents involved in the sale of machinery, industrial equipment, ships and aircraft
Creditors Due Within One Year | 2012-05-01 | £ 63,507 |
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Creditors and other liabilities
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These are the financial reports (either an abhreviated set of accounts or profit& loss statement and balance sheet) have been filed with Companies House. The reports allow you to do a basic business credit check on IDB TECHNOLOGIES LIMITED
Called Up Share Capital | 2012-05-01 | £ 50,001 |
---|---|---|
Called Up Share Capital | 2012-04-30 | £ 50,001 |
Called Up Share Capital | 2011-04-30 | £ 50,001 |
Cash Bank In Hand | 2012-05-01 | £ 26,666 |
Cash Bank In Hand | 2012-04-30 | £ 52,313 |
Cash Bank In Hand | 2011-04-30 | £ 15,792 |
Current Assets | 2012-05-01 | £ 99,685 |
Current Assets | 2012-04-30 | £ 129,354 |
Current Assets | 2011-04-30 | £ 117,800 |
Debtors | 2012-05-01 | £ 39,169 |
Debtors | 2012-04-30 | £ 46,790 |
Debtors | 2011-04-30 | £ 76,474 |
Fixed Assets | 2012-05-01 | £ 18,771 |
Fixed Assets | 2012-04-30 | £ 25,017 |
Fixed Assets | 2011-04-30 | £ 33,238 |
Shareholder Funds | 2012-05-01 | £ 54,949 |
Shareholder Funds | 2012-04-30 | £ 66,826 |
Shareholder Funds | 2011-04-30 | £ 86,631 |
Stocks Inventory | 2012-05-01 | £ 33,850 |
Stocks Inventory | 2012-04-30 | £ 30,251 |
Stocks Inventory | 2011-04-30 | £ 25,534 |
Tangible Fixed Assets | 2012-05-01 | £ 18,771 |
Tangible Fixed Assets | 2012-04-30 | £ 25,017 |
Tangible Fixed Assets | 2011-04-30 | £ 33,238 |
Debtors and other cash assets
The top companies supplying to UK government with the same SIC code (46140 - Agents involved in the sale of machinery, industrial equipment, ships and aircraft) as IDB TECHNOLOGIES LIMITED are:
Origin | Destination | Date | Import Code | Imported Goods classification description |
---|---|---|---|---|
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
85415000 | Semiconductor devices, n.e.s. | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
85415000 | Semiconductor devices, n.e.s. | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
29420000 | Separate chemically defined organic compounds, n.e.s. | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
85423190 | Electronic integrated circuits as processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits (excl. in the form of multichip integrated circuits) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
85423190 | Electronic integrated circuits as processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits (excl. in the form of multichip integrated circuits) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38109090 | Fluxes and other auxiliary preparations for soldering, brazing or welding (excl. preparations of a kind used as cores or coatings for welding electrodes or rods, soldering, brazing or welding powders and pastes consisting of metal and other materials, and welding electrodes or rods of base metals or metal carbides coated with fluxes) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) |
For goods imported into the United Kingdom, only imports originating from outside the EU are shown
Initiating party | Event Type | Notices to Creditors | |
---|---|---|---|
Defending party | IDB TECHNOLOGIES LIMITED | Event Date | 2019-02-05 |
(Registered in England and Wales) ("the Company") The Company was placed into members' voluntary liquidation on 30 January 2019 when Simon Robert Haskew (IP Number 008988 ) and Neil Frank Vinnicombe (IP Number 009519 ), both of Begbies Traynor (Central) LLP , of St James Court, St James Parade, Bristol BS1 3LH were appointed as Joint Liquidators of the Company. The Company is able to pay all its known creditors in full. Notice is hereby given, pursuant to Part 14 of the Insolvency (England and Wales) Rules 2016, that the Joint Liquidators of the Company intend to make a distribution to creditors. Creditors of the Company are required, on or before 8 March 2019, to prove their debts by sending to Simon Robert Haskew of Begbies Traynor (Central) LLP, of St James Court, St James Parade, Bristol BS1 3LH, the Joint Liquidator of the Company, written statements of the amount they claim to be due to them from the Company. They must also, if so requested, provide such further details or produce such documentary or other evidence as may appear to the Joint Liquidators to be necessary. A creditor who has not proved his debt before 8 March 2019, or who increases the claim in his proof after that date, will not be entitled to disturb, by reason that he has not participated in it, the intended distribution or any other distribution declared before his debt is proved. The Joint Liquidators intend that, after paying or providing for a first and final distribution in respect of the claims of all creditors who have proved their debts by the above date, the funds remaining in the hands of the Joint Liquidators shall be distributed to shareholders absolutely. Contact Details Proofs of debts must be delivered to the Joint Liquidators and can be sent by post to Begbies Traynor (Central) LLP, of St James Court, St James Parade, Bristol BS1 3LH or alternatively by email to caroline.priest@begbies-traynor.com . Any person who requires further information may contact the Joint Liquidator by telephone on 0117 937 7130 . Alternatively enquiries can be made to Caroline Priest by telephone on 0117 937 7130. Simon Haskew , Joint Liquidator : | |||
Initiating party | Event Type | Appointment of Liquidators | |
Defending party | IDB TECHNOLOGIES LIMITED | Event Date | 2019-01-30 |
Simon Robert Haskew and Neil Frank Vinnicombe , both of Begbies Traynor (Central) LLP , St James Court, St James Parade, Bristol BS1 3LH : | |||
Initiating party | Event Type | Resolutions for Winding-up | |
Defending party | IDB TECHNOLOGIES LIMITED | Event Date | 2019-01-30 |
Notification of written resolutions of the above-named Company proposed by the directors and having effect as a special resolution and as an ordinary resolution respectively pursuant to the provisions of Part 13 of the Companies Act 2006 . Circulation Date: 29 January 2019 Effective Date: 30 January 2019 I, the undersigned, being a director of the Company hereby certify that the following written resolutions were circulated to all eligible members of the Company on the Circulation Date and that the written resolutions were passed on the Effective Date: "That the Company be wound up voluntarily and that Simon Robert Haskew and Neil Frank Vinnicombe both of Begbies Traynor (Central) LLP of St James Court, St James Parade, Bristol, BS1 3LH be and are hereby appointed as joint liquidators for the purposes of such winding up and that any power conferred on them by law or by this resolution, may be exercised and any act required or authorised under any enactment to be done by them, may be done by them jointly or by each of them alone." Simon Robert Haskew (IP Number: 008988 ) and Neil Frank Vinnicombe (IP Number: 009519 ). Any person who requires further information may contact the Joint Liquidator by telephone on 0117 937 7130 . Alternatively enquiries can be made to Caroline Priest by e-mail at caroline.priest@begbies-traynor.com or by telephone on 0117 937 7130. Ian David Burnett : | |||
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